Microelectronics Packaging Handbook 
/ Rao R. Tummala, Eugene J. Rymaszewski 
 - New York  : Van Nostrand Reinhold  , 1988 
 - xx, 1194p.  : ill.  ; 23 cm. 
<br/><br/><label>ISBN: </label>0442205783 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packing--- Handbooks, manuals, etc.
<br/><br/><label>LC Class. No.: </label>TK 7874  / T824 1988